JPS6437038U - - Google Patents
Info
- Publication number
- JPS6437038U JPS6437038U JP1987131198U JP13119887U JPS6437038U JP S6437038 U JPS6437038 U JP S6437038U JP 1987131198 U JP1987131198 U JP 1987131198U JP 13119887 U JP13119887 U JP 13119887U JP S6437038 U JPS6437038 U JP S6437038U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- metal layer
- electrode metal
- bumps
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/851—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131198U JPS6437038U (enExample) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131198U JPS6437038U (enExample) | 1987-08-28 | 1987-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437038U true JPS6437038U (enExample) | 1989-03-06 |
Family
ID=31387040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987131198U Pending JPS6437038U (enExample) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437038U (enExample) |
-
1987
- 1987-08-28 JP JP1987131198U patent/JPS6437038U/ja active Pending