JPS6377346U - - Google Patents
Info
- Publication number
- JPS6377346U JPS6377346U JP1986171014U JP17101486U JPS6377346U JP S6377346 U JPS6377346 U JP S6377346U JP 1986171014 U JP1986171014 U JP 1986171014U JP 17101486 U JP17101486 U JP 17101486U JP S6377346 U JPS6377346 U JP S6377346U
- Authority
- JP
- Japan
- Prior art keywords
- solder bump
- base metal
- copper
- electrode
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/012—
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986171014U JPS6377346U (enExample) | 1986-11-07 | 1986-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986171014U JPS6377346U (enExample) | 1986-11-07 | 1986-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6377346U true JPS6377346U (enExample) | 1988-05-23 |
Family
ID=31106260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986171014U Pending JPS6377346U (enExample) | 1986-11-07 | 1986-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6377346U (enExample) |
-
1986
- 1986-11-07 JP JP1986171014U patent/JPS6377346U/ja active Pending