JPS6181142U - - Google Patents
Info
- Publication number
- JPS6181142U JPS6181142U JP1984167043U JP16704384U JPS6181142U JP S6181142 U JPS6181142 U JP S6181142U JP 1984167043 U JP1984167043 U JP 1984167043U JP 16704384 U JP16704384 U JP 16704384U JP S6181142 U JPS6181142 U JP S6181142U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- solder
- electrode plate
- metal electrode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/073—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167043U JPS6181142U (enExample) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167043U JPS6181142U (enExample) | 1984-11-02 | 1984-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181142U true JPS6181142U (enExample) | 1986-05-29 |
Family
ID=30724845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984167043U Pending JPS6181142U (enExample) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181142U (enExample) |
-
1984
- 1984-11-02 JP JP1984167043U patent/JPS6181142U/ja active Pending