JPH01104029U - - Google Patents
Info
- Publication number
- JPH01104029U JPH01104029U JP1987197262U JP19726287U JPH01104029U JP H01104029 U JPH01104029 U JP H01104029U JP 1987197262 U JP1987197262 U JP 1987197262U JP 19726287 U JP19726287 U JP 19726287U JP H01104029 U JPH01104029 U JP H01104029U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pad
- silicon substrate
- gap
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W70/60—
-
- H10W72/932—
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- H10W72/934—
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987197262U JPH01104029U (enExample) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987197262U JPH01104029U (enExample) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104029U true JPH01104029U (enExample) | 1989-07-13 |
Family
ID=31487825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987197262U Pending JPH01104029U (enExample) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104029U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010225654A (ja) * | 2009-03-19 | 2010-10-07 | Toyota Central R&D Labs Inc | 半導体装置 |
-
1987
- 1987-12-28 JP JP1987197262U patent/JPH01104029U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010225654A (ja) * | 2009-03-19 | 2010-10-07 | Toyota Central R&D Labs Inc | 半導体装置 |