JPS63100832U - - Google Patents
Info
- Publication number
- JPS63100832U JPS63100832U JP1986195594U JP19559486U JPS63100832U JP S63100832 U JPS63100832 U JP S63100832U JP 1986195594 U JP1986195594 U JP 1986195594U JP 19559486 U JP19559486 U JP 19559486U JP S63100832 U JPS63100832 U JP S63100832U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- soldered
- semiconductor device
- thickness
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/60—
-
- H10W72/076—
-
- H10W72/07653—
-
- H10W72/631—
-
- H10W74/00—
-
- H10W90/736—
-
- H10W90/766—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195594U JPS63100832U (enExample) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195594U JPS63100832U (enExample) | 1986-12-19 | 1986-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100832U true JPS63100832U (enExample) | 1988-06-30 |
Family
ID=31153623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986195594U Pending JPS63100832U (enExample) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100832U (enExample) |
-
1986
- 1986-12-19 JP JP1986195594U patent/JPS63100832U/ja active Pending