JPH036841U - - Google Patents
Info
- Publication number
- JPH036841U JPH036841U JP1989066943U JP6694389U JPH036841U JP H036841 U JPH036841 U JP H036841U JP 1989066943 U JP1989066943 U JP 1989066943U JP 6694389 U JP6694389 U JP 6694389U JP H036841 U JPH036841 U JP H036841U
- Authority
- JP
- Japan
- Prior art keywords
- lead portion
- die pad
- outer lead
- insulating film
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5473—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989066943U JPH036841U (enExample) | 1989-06-08 | 1989-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989066943U JPH036841U (enExample) | 1989-06-08 | 1989-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036841U true JPH036841U (enExample) | 1991-01-23 |
Family
ID=31600082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989066943U Pending JPH036841U (enExample) | 1989-06-08 | 1989-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036841U (enExample) |
-
1989
- 1989-06-08 JP JP1989066943U patent/JPH036841U/ja active Pending