JPS63197354U - - Google Patents
Info
- Publication number
- JPS63197354U JPS63197354U JP1987089255U JP8925587U JPS63197354U JP S63197354 U JPS63197354 U JP S63197354U JP 1987089255 U JP1987089255 U JP 1987089255U JP 8925587 U JP8925587 U JP 8925587U JP S63197354 U JPS63197354 U JP S63197354U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- lead frame
- view
- plan
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/07168—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/932—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089255U JPS63197354U (enExample) | 1987-06-09 | 1987-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089255U JPS63197354U (enExample) | 1987-06-09 | 1987-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197354U true JPS63197354U (enExample) | 1988-12-19 |
Family
ID=30948080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987089255U Pending JPS63197354U (enExample) | 1987-06-09 | 1987-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197354U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000044040A1 (fr) * | 1999-01-22 | 2000-07-27 | Seiko Epson Corporation | Technique de soudage de fils, dispositif semi-conducteur, carte de circuit imprime, dispositif electronique et poste de soudure |
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1987
- 1987-06-09 JP JP1987089255U patent/JPS63197354U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000044040A1 (fr) * | 1999-01-22 | 2000-07-27 | Seiko Epson Corporation | Technique de soudage de fils, dispositif semi-conducteur, carte de circuit imprime, dispositif electronique et poste de soudure |