JPH0456336U - - Google Patents
Info
- Publication number
- JPH0456336U JPH0456336U JP1990099887U JP9988790U JPH0456336U JP H0456336 U JPH0456336 U JP H0456336U JP 1990099887 U JP1990099887 U JP 1990099887U JP 9988790 U JP9988790 U JP 9988790U JP H0456336 U JPH0456336 U JP H0456336U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- connecting means
- semiconductor device
- bonding wire
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/07552—
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- H10W72/07553—
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- H10W72/07554—
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- H10W72/527—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/537—
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- H10W72/5445—
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- H10W72/5449—
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- H10W72/884—
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- H10W72/932—
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- H10W74/00—
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- H10W90/24—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990099887U JPH0456336U (enExample) | 1990-09-25 | 1990-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990099887U JPH0456336U (enExample) | 1990-09-25 | 1990-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456336U true JPH0456336U (enExample) | 1992-05-14 |
Family
ID=31842127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990099887U Pending JPH0456336U (enExample) | 1990-09-25 | 1990-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456336U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335680A (ja) * | 1994-06-14 | 1995-12-22 | Fujitsu Ltd | 回路基板及びその製造方法、並びに半導体装置のワイヤボンディング方法及び半導体装置の封止方法 |
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1990
- 1990-09-25 JP JP1990099887U patent/JPH0456336U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335680A (ja) * | 1994-06-14 | 1995-12-22 | Fujitsu Ltd | 回路基板及びその製造方法、並びに半導体装置のワイヤボンディング方法及び半導体装置の封止方法 |