JPH01165638U - - Google Patents
Info
- Publication number
- JPH01165638U JPH01165638U JP1988061503U JP6150388U JPH01165638U JP H01165638 U JPH01165638 U JP H01165638U JP 1988061503 U JP1988061503 U JP 1988061503U JP 6150388 U JP6150388 U JP 6150388U JP H01165638 U JPH01165638 U JP H01165638U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- package
- bonding wires
- circuit package
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
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- H10W70/682—
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- H10W72/07551—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061503U JPH01165638U (enExample) | 1988-05-09 | 1988-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061503U JPH01165638U (enExample) | 1988-05-09 | 1988-05-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165638U true JPH01165638U (enExample) | 1989-11-20 |
Family
ID=31287170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988061503U Pending JPH01165638U (enExample) | 1988-05-09 | 1988-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165638U (enExample) |
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1988
- 1988-05-09 JP JP1988061503U patent/JPH01165638U/ja active Pending