JPS63193836U - - Google Patents
Info
- Publication number
- JPS63193836U JPS63193836U JP1987085165U JP8516587U JPS63193836U JP S63193836 U JPS63193836 U JP S63193836U JP 1987085165 U JP1987085165 U JP 1987085165U JP 8516587 U JP8516587 U JP 8516587U JP S63193836 U JPS63193836 U JP S63193836U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- height
- semiconductor element
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987085165U JPS63193836U (enExample) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987085165U JPS63193836U (enExample) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193836U true JPS63193836U (enExample) | 1988-12-14 |
Family
ID=30940322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987085165U Pending JPS63193836U (enExample) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193836U (enExample) |
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1987
- 1987-05-29 JP JP1987085165U patent/JPS63193836U/ja active Pending