JPS6429827U - - Google Patents
Info
- Publication number
- JPS6429827U JPS6429827U JP1987123686U JP12368687U JPS6429827U JP S6429827 U JPS6429827 U JP S6429827U JP 1987123686 U JP1987123686 U JP 1987123686U JP 12368687 U JP12368687 U JP 12368687U JP S6429827 U JPS6429827 U JP S6429827U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- die pad
- semiconductor element
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123686U JPS6429827U (enExample) | 1987-08-12 | 1987-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123686U JPS6429827U (enExample) | 1987-08-12 | 1987-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6429827U true JPS6429827U (enExample) | 1989-02-22 |
Family
ID=31372764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987123686U Pending JPS6429827U (enExample) | 1987-08-12 | 1987-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6429827U (enExample) |
-
1987
- 1987-08-12 JP JP1987123686U patent/JPS6429827U/ja active Pending