JPS6294632U - - Google Patents
Info
- Publication number
- JPS6294632U JPS6294632U JP1985186580U JP18658085U JPS6294632U JP S6294632 U JPS6294632 U JP S6294632U JP 1985186580 U JP1985186580 U JP 1985186580U JP 18658085 U JP18658085 U JP 18658085U JP S6294632 U JPS6294632 U JP S6294632U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting parts
- mounting
- cross
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985186580U JPS6294632U (enExample) | 1985-12-03 | 1985-12-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985186580U JPS6294632U (enExample) | 1985-12-03 | 1985-12-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6294632U true JPS6294632U (enExample) | 1987-06-17 |
Family
ID=31136262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985186580U Pending JPS6294632U (enExample) | 1985-12-03 | 1985-12-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6294632U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0426144A (ja) * | 1990-05-22 | 1992-01-29 | Nec Corp | 半導体装置用パッケージ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5797659A (en) * | 1980-12-10 | 1982-06-17 | Matsushita Electronics Corp | Lead frame |
-
1985
- 1985-12-03 JP JP1985186580U patent/JPS6294632U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5797659A (en) * | 1980-12-10 | 1982-06-17 | Matsushita Electronics Corp | Lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0426144A (ja) * | 1990-05-22 | 1992-01-29 | Nec Corp | 半導体装置用パッケージ |