JPS6294632U - - Google Patents

Info

Publication number
JPS6294632U
JPS6294632U JP1985186580U JP18658085U JPS6294632U JP S6294632 U JPS6294632 U JP S6294632U JP 1985186580 U JP1985186580 U JP 1985186580U JP 18658085 U JP18658085 U JP 18658085U JP S6294632 U JPS6294632 U JP S6294632U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting parts
mounting
cross
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985186580U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985186580U priority Critical patent/JPS6294632U/ja
Publication of JPS6294632U publication Critical patent/JPS6294632U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂはこの考案の一実施例を示す平面
図及び断面図、第２図ａ，ｂはこの考案の他の実
施例を示す平面図及び断面図、第３図ａ，ｂ，ｃ
は従来のダイパツドを示す平面図及び断面図であ
る。 図において、１ａは接合部ダイパツド、１ｂは
ダイパツド連結部、２は宙吊りピン、３は半導体
素子、４は接合部材、５はスリツトである。なお
、図中、同一符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子と、この半導体素子を固着する複数
    の載置部と、前記半導体素子と空間を介して配置
    され、前記複数の載置部を互いに連結すると共に
    、その連結部の断面が、前記適載置部の断面より
    小さい連結部材とを備えた半導体装置。
JP1985186580U 1985-12-03 1985-12-03 Pending JPS6294632U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985186580U JPS6294632U (ja) 1985-12-03 1985-12-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985186580U JPS6294632U (ja) 1985-12-03 1985-12-03

Publications (1)

Publication Number Publication Date
JPS6294632U true JPS6294632U (ja) 1987-06-17

Family

ID=31136262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985186580U Pending JPS6294632U (ja) 1985-12-03 1985-12-03

Country Status (1)

Country Link
JP (1) JPS6294632U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0426144A (ja) * 1990-05-22 1992-01-29 Nec Corp 半導体装置用パッケージ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797659A (en) * 1980-12-10 1982-06-17 Matsushita Electronics Corp Lead frame

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797659A (en) * 1980-12-10 1982-06-17 Matsushita Electronics Corp Lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0426144A (ja) * 1990-05-22 1992-01-29 Nec Corp 半導体装置用パッケージ

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