JPS61125057U - - Google Patents
Info
- Publication number
- JPS61125057U JPS61125057U JP1985008130U JP813085U JPS61125057U JP S61125057 U JPS61125057 U JP S61125057U JP 1985008130 U JP1985008130 U JP 1985008130U JP 813085 U JP813085 U JP 813085U JP S61125057 U JPS61125057 U JP S61125057U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- firmly mounted
- hybrid
- semiconductor pellets
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985008130U JPS61125057U (enExample) | 1985-01-24 | 1985-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985008130U JPS61125057U (enExample) | 1985-01-24 | 1985-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61125057U true JPS61125057U (enExample) | 1986-08-06 |
Family
ID=30487131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985008130U Pending JPS61125057U (enExample) | 1985-01-24 | 1985-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61125057U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009283563A (ja) * | 2008-05-20 | 2009-12-03 | Asmo Co Ltd | 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法 |
| JP2010096191A (ja) * | 2008-10-14 | 2010-04-30 | Hitachi Automotive Systems Ltd | 変速制御装置および電子回路封入装置 |
| JP2010114346A (ja) * | 2008-11-10 | 2010-05-20 | Asmo Co Ltd | 樹脂封止型半導体装置及び樹脂封止半導体装置の製造方法 |
-
1985
- 1985-01-24 JP JP1985008130U patent/JPS61125057U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009283563A (ja) * | 2008-05-20 | 2009-12-03 | Asmo Co Ltd | 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法 |
| JP2010096191A (ja) * | 2008-10-14 | 2010-04-30 | Hitachi Automotive Systems Ltd | 変速制御装置および電子回路封入装置 |
| JP2010114346A (ja) * | 2008-11-10 | 2010-05-20 | Asmo Co Ltd | 樹脂封止型半導体装置及び樹脂封止半導体装置の製造方法 |