JPH0470742U - - Google Patents

Info

Publication number
JPH0470742U
JPH0470742U JP1990114487U JP11448790U JPH0470742U JP H0470742 U JPH0470742 U JP H0470742U JP 1990114487 U JP1990114487 U JP 1990114487U JP 11448790 U JP11448790 U JP 11448790U JP H0470742 U JPH0470742 U JP H0470742U
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding
bonding wires
chip carrier
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990114487U
Other languages
English (en)
Japanese (ja)
Other versions
JP2506783Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990114487U priority Critical patent/JP2506783Y2/ja
Publication of JPH0470742U publication Critical patent/JPH0470742U/ja
Application granted granted Critical
Publication of JP2506783Y2 publication Critical patent/JP2506783Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5449—
    • H10W72/5475—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP1990114487U 1990-10-31 1990-10-31 半導体装置 Expired - Lifetime JP2506783Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990114487U JP2506783Y2 (ja) 1990-10-31 1990-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990114487U JP2506783Y2 (ja) 1990-10-31 1990-10-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH0470742U true JPH0470742U (enExample) 1992-06-23
JP2506783Y2 JP2506783Y2 (ja) 1996-08-14

Family

ID=31862170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990114487U Expired - Lifetime JP2506783Y2 (ja) 1990-10-31 1990-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JP2506783Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023089774A1 (enExample) * 2021-11-19 2023-05-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023089774A1 (enExample) * 2021-11-19 2023-05-25
WO2023089774A1 (ja) * 2021-11-19 2023-05-25 日本電信電話株式会社 ドライバ集積ｉｑ光変調器

Also Published As

Publication number Publication date
JP2506783Y2 (ja) 1996-08-14

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term