JPS6430854U - - Google Patents
Info
- Publication number
- JPS6430854U JPS6430854U JP1987127001U JP12700187U JPS6430854U JP S6430854 U JPS6430854 U JP S6430854U JP 1987127001 U JP1987127001 U JP 1987127001U JP 12700187 U JP12700187 U JP 12700187U JP S6430854 U JPS6430854 U JP S6430854U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- package
- lead frame
- adhered
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W70/682—
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- H10W72/07353—
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- H10W72/321—
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- H10W72/334—
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- H10W72/884—
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- H10W72/931—
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- H10W90/734—
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- H10W90/736—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987127001U JPS6430854U (enExample) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987127001U JPS6430854U (enExample) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430854U true JPS6430854U (enExample) | 1989-02-27 |
Family
ID=31379027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987127001U Pending JPS6430854U (enExample) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430854U (enExample) |
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1987
- 1987-08-20 JP JP1987127001U patent/JPS6430854U/ja active Pending