JPH01146543U - - Google Patents
Info
- Publication number
- JPH01146543U JPH01146543U JP1988042068U JP4206888U JPH01146543U JP H01146543 U JPH01146543 U JP H01146543U JP 1988042068 U JP1988042068 U JP 1988042068U JP 4206888 U JP4206888 U JP 4206888U JP H01146543 U JPH01146543 U JP H01146543U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- light
- photosensitive area
- sealing body
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Non-Volatile Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988042068U JPH01146543U (enExample) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988042068U JPH01146543U (enExample) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146543U true JPH01146543U (enExample) | 1989-10-09 |
Family
ID=31268493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988042068U Pending JPH01146543U (enExample) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146543U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243540A (ja) * | 1992-02-27 | 1993-09-21 | Sanyo Electric Co Ltd | 固体撮像素子及びその製造方法 |
| KR101032061B1 (ko) * | 2008-10-16 | 2011-05-02 | 르네사스 일렉트로닉스 가부시키가이샤 | 전자 장치 및 전자 장치의 제조 방법 |
-
1988
- 1988-03-31 JP JP1988042068U patent/JPH01146543U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243540A (ja) * | 1992-02-27 | 1993-09-21 | Sanyo Electric Co Ltd | 固体撮像素子及びその製造方法 |
| KR101032061B1 (ko) * | 2008-10-16 | 2011-05-02 | 르네사스 일렉트로닉스 가부시키가이샤 | 전자 장치 및 전자 장치의 제조 방법 |