JPH0226240U - - Google Patents
Info
- Publication number
- JPH0226240U JPH0226240U JP1988104310U JP10431088U JPH0226240U JP H0226240 U JPH0226240 U JP H0226240U JP 1988104310 U JP1988104310 U JP 1988104310U JP 10431088 U JP10431088 U JP 10431088U JP H0226240 U JPH0226240 U JP H0226240U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- resin encapsulation
- encapsulation mold
- mold
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104310U JPH0226240U (enExample) | 1988-08-06 | 1988-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104310U JPH0226240U (enExample) | 1988-08-06 | 1988-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226240U true JPH0226240U (enExample) | 1990-02-21 |
Family
ID=31335914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988104310U Pending JPH0226240U (enExample) | 1988-08-06 | 1988-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226240U (enExample) |
-
1988
- 1988-08-06 JP JP1988104310U patent/JPH0226240U/ja active Pending