JPH0395639U - - Google Patents

Info

Publication number
JPH0395639U
JPH0395639U JP1990003450U JP345090U JPH0395639U JP H0395639 U JPH0395639 U JP H0395639U JP 1990003450 U JP1990003450 U JP 1990003450U JP 345090 U JP345090 U JP 345090U JP H0395639 U JPH0395639 U JP H0395639U
Authority
JP
Japan
Prior art keywords
semiconductor device
back surface
package
sectional
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990003450U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990003450U priority Critical patent/JPH0395639U/ja
Publication of JPH0395639U publication Critical patent/JPH0395639U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30

Landscapes

  • Die Bonding (AREA)
JP1990003450U 1990-01-17 1990-01-17 Pending JPH0395639U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990003450U JPH0395639U (enExample) 1990-01-17 1990-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990003450U JPH0395639U (enExample) 1990-01-17 1990-01-17

Publications (1)

Publication Number Publication Date
JPH0395639U true JPH0395639U (enExample) 1991-09-30

Family

ID=31507269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990003450U Pending JPH0395639U (enExample) 1990-01-17 1990-01-17

Country Status (1)

Country Link
JP (1) JPH0395639U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11309219B2 (en) 2019-09-17 2022-04-19 Kioxia Corporation Method for manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11309219B2 (en) 2019-09-17 2022-04-19 Kioxia Corporation Method for manufacturing semiconductor device

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