JPS6338327U - - Google Patents
Info
- Publication number
- JPS6338327U JPS6338327U JP1986129475U JP12947586U JPS6338327U JP S6338327 U JPS6338327 U JP S6338327U JP 1986129475 U JP1986129475 U JP 1986129475U JP 12947586 U JP12947586 U JP 12947586U JP S6338327 U JPS6338327 U JP S6338327U
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor device
- bonding pad
- film thickness
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/934—
-
- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986129475U JPS6338327U (enExample) | 1986-08-27 | 1986-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986129475U JPS6338327U (enExample) | 1986-08-27 | 1986-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6338327U true JPS6338327U (enExample) | 1988-03-11 |
Family
ID=31026076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986129475U Pending JPS6338327U (enExample) | 1986-08-27 | 1986-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6338327U (enExample) |
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1986
- 1986-08-27 JP JP1986129475U patent/JPS6338327U/ja active Pending