JPS5851443U - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JPS5851443U
JPS5851443U JP1981146441U JP14644181U JPS5851443U JP S5851443 U JPS5851443 U JP S5851443U JP 1981146441 U JP1981146441 U JP 1981146441U JP 14644181 U JP14644181 U JP 14644181U JP S5851443 U JPS5851443 U JP S5851443U
Authority
JP
Japan
Prior art keywords
semiconductor element
external lead
semiconductor device
out electrodes
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981146441U
Other languages
English (en)
Inventor
牧　朋一
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1981146441U priority Critical patent/JPS5851443U/ja
Publication of JPS5851443U publication Critical patent/JPS5851443U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のアップサイドダウン構造のトランジスタ
の断面図、第２図は本考案の一実施例によるトランジス
タチップの断面図、第３図は本考案のトランジスタチッ
プを用いたトランジスタの断面図である。 １・・・ベース領域、２・・・エミッタ領域、３・・・
絶縁膜、４・・・ベース電極、５・・・エミッタ電極、
６・・・ベース用開口部、７・・・エミッタ用開口部、
８・・・金層、９・・・シリコン層、１０・・・外部電
極（メタライズ層）、１１・・・半導体基板（コレクタ
）、１２・・・セラミック、１３・・・共晶合金層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体本体の一表面の側に２つ以上の外部導出用電極を
    有し、該外部導出電極を半導体素子保持用部材に直接固
    着される半導体素子において、上記外部等出用電極の少
    くとも一部が上記半導体素子保持用部材への接続のため
    でロー材で構成されていることを特徴とする半導体素子
    。
JP1981146441U 1981-10-01 1981-10-01 半導体素子 Pending JPS5851443U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981146441U JPS5851443U (ja) 1981-10-01 1981-10-01 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981146441U JPS5851443U (ja) 1981-10-01 1981-10-01 半導体素子

Publications (1)

Publication Number Publication Date
JPS5851443U true JPS5851443U (ja) 1983-04-07

Family

ID=29939347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981146441U Pending JPS5851443U (ja) 1981-10-01 1981-10-01 半導体素子

Country Status (1)

Country Link
JP (1) JPS5851443U (ja)

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