JPH01165652U - - Google Patents
Info
- Publication number
- JPH01165652U JPH01165652U JP1988061803U JP6180388U JPH01165652U JP H01165652 U JPH01165652 U JP H01165652U JP 1988061803 U JP1988061803 U JP 1988061803U JP 6180388 U JP6180388 U JP 6180388U JP H01165652 U JPH01165652 U JP H01165652U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sealed semiconductor
- insulated resin
- resin
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ〜ｃは本考案の一実施例を示す図であ
り、第１図ａは装置の表面一部断面図、第１図ｂ
は第１図ａのＡ−Ａ′断面図、第１図ｃは背面図
である。第２図は本考案の他の実施例を示す図で
あり、第２図ａは背面図、第２図ｂは第２図ａの
Ａ−Ａ′断面図である。第３図は従来の装置図で
あり、第３図ａは背面図、第３図ｂは第３図ａの
Ａ−Ａ′断面図である。 １……支持体、２……半導体素子、３……接着
材、４……内部連結線、５……樹脂、６……外部
リード、７……放熱板取付穴、８……高熱伝導体
。
り、第１図ａは装置の表面一部断面図、第１図ｂ
は第１図ａのＡ−Ａ′断面図、第１図ｃは背面図
である。第２図は本考案の他の実施例を示す図で
あり、第２図ａは背面図、第２図ｂは第２図ａの
Ａ−Ａ′断面図である。第３図は従来の装置図で
あり、第３図ａは背面図、第３図ｂは第３図ａの
Ａ−Ａ′断面図である。 １……支持体、２……半導体素子、３……接着
材、４……内部連結線、５……樹脂、６……外部
リード、７……放熱板取付穴、８……高熱伝導体
。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 絶縁型樹脂封止半導体装置の裏面から半導
体素子基板を接着している支持体近傍まで空いて
いる放熱板取付穴を有することを特徴とする絶縁
型樹脂封止半導体装置。 (2) 請求項１記載の絶縁型樹脂封止半導体装置
において、前記半導体素子基板を接着している前
記支持体の裏面の樹脂中に前記放熱板取付穴と接
する高熱伝導体を有することを特徴とする請求項
１記載の絶縁型樹脂封止半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061803U JPH01165652U (ja) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061803U JPH01165652U (ja) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165652U true JPH01165652U (ja) | 1989-11-20 |
Family
ID=31287448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988061803U Pending JPH01165652U (ja) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165652U (ja) |
-
1988
- 1988-05-10 JP JP1988061803U patent/JPH01165652U/ja active Pending