JPS63157935U - - Google Patents
Info
- Publication number
- JPS63157935U JPS63157935U JP1987051122U JP5112287U JPS63157935U JP S63157935 U JPS63157935 U JP S63157935U JP 1987051122 U JP1987051122 U JP 1987051122U JP 5112287 U JP5112287 U JP 5112287U JP S63157935 U JPS63157935 U JP S63157935U
- Authority
- JP
- Japan
- Prior art keywords
- pad electrode
- semiconductor device
- less
- long side
- short side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/941—Dispositions of bond pads
- H10W72/9413—Dispositions of bond pads on encapsulations
Landscapes
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987051122U JPS63157935U (enExample) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987051122U JPS63157935U (enExample) | 1987-04-03 | 1987-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157935U true JPS63157935U (enExample) | 1988-10-17 |
Family
ID=30875094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987051122U Pending JPS63157935U (enExample) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157935U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60132351A (ja) * | 1983-12-21 | 1985-07-15 | Hitachi Ltd | 半導体装置 |
| JPS6242441A (ja) * | 1985-08-19 | 1987-02-24 | Nec Corp | 集積回路装置 |
-
1987
- 1987-04-03 JP JP1987051122U patent/JPS63157935U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60132351A (ja) * | 1983-12-21 | 1985-07-15 | Hitachi Ltd | 半導体装置 |
| JPS6242441A (ja) * | 1985-08-19 | 1987-02-24 | Nec Corp | 集積回路装置 |