JPS63118235U - - Google Patents
Info
- Publication number
- JPS63118235U JPS63118235U JP1987008406U JP840687U JPS63118235U JP S63118235 U JPS63118235 U JP S63118235U JP 1987008406 U JP1987008406 U JP 1987008406U JP 840687 U JP840687 U JP 840687U JP S63118235 U JPS63118235 U JP S63118235U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- roughening
- semiconductor
- insulating material
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/923—
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- H10W72/934—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987008406U JPS63118235U (enExample) | 1987-01-22 | 1987-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987008406U JPS63118235U (enExample) | 1987-01-22 | 1987-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118235U true JPS63118235U (enExample) | 1988-07-30 |
Family
ID=30792752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987008406U Pending JPS63118235U (enExample) | 1987-01-22 | 1987-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118235U (enExample) |
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1987
- 1987-01-22 JP JP1987008406U patent/JPS63118235U/ja active Pending