JPH0252355U - - Google Patents
Info
- Publication number
- JPH0252355U JPH0252355U JP1988130636U JP13063688U JPH0252355U JP H0252355 U JPH0252355 U JP H0252355U JP 1988130636 U JP1988130636 U JP 1988130636U JP 13063688 U JP13063688 U JP 13063688U JP H0252355 U JPH0252355 U JP H0252355U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor device
- semiconductor chip
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/07551—
-
- H10W72/536—
-
- H10W72/5445—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988130636U JPH0252355U (enExample) | 1988-10-04 | 1988-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988130636U JPH0252355U (enExample) | 1988-10-04 | 1988-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252355U true JPH0252355U (enExample) | 1990-04-16 |
Family
ID=31385983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988130636U Pending JPH0252355U (enExample) | 1988-10-04 | 1988-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252355U (enExample) |
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1988
- 1988-10-04 JP JP1988130636U patent/JPH0252355U/ja active Pending