JPH0465456U - - Google Patents
Info
- Publication number
- JPH0465456U JPH0465456U JP1990107782U JP10778290U JPH0465456U JP H0465456 U JPH0465456 U JP H0465456U JP 1990107782 U JP1990107782 U JP 1990107782U JP 10778290 U JP10778290 U JP 10778290U JP H0465456 U JPH0465456 U JP H0465456U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor element
- semiconductor
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
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- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5445—
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- H10W72/5449—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990107782U JPH0465456U (enExample) | 1990-10-15 | 1990-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990107782U JPH0465456U (enExample) | 1990-10-15 | 1990-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465456U true JPH0465456U (enExample) | 1992-06-08 |
Family
ID=31854458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990107782U Pending JPH0465456U (enExample) | 1990-10-15 | 1990-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465456U (enExample) |
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1990
- 1990-10-15 JP JP1990107782U patent/JPH0465456U/ja active Pending