JPS6359325U - - Google Patents
Info
- Publication number
- JPS6359325U JPS6359325U JP15345286U JP15345286U JPS6359325U JP S6359325 U JPS6359325 U JP S6359325U JP 15345286 U JP15345286 U JP 15345286U JP 15345286 U JP15345286 U JP 15345286U JP S6359325 U JPS6359325 U JP S6359325U
- Authority
- JP
- Japan
- Prior art keywords
- die
- lead frame
- bonding
- lead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来装置を示す断面図である。 図において、１はリードフレーム、１ａはイン
ナーリード、１ｂはダイパツド、１ｃは宙吊りリ
ード、４はワイヤ、５はダイである。なお、図中
、同一符号は同一、又は相当部分を示す。
２図は従来装置を示す断面図である。 図において、１はリードフレーム、１ａはイン
ナーリード、１ｂはダイパツド、１ｃは宙吊りリ
ード、４はワイヤ、５はダイである。なお、図中
、同一符号は同一、又は相当部分を示す。
Claims (1)
- ダイパツド沈めしたリードフレームのダイパツ
ド上にダイをボンデイング後、ダイの電極と、リ
ードフレームのインナーリードとの間にワイヤー
ボンデイングするものにおいて、インナーリード
のボンデイング面高さをダイ表面と略同一、もし
くは高くしたことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15345286U JPS6359325U (ja) | 1986-10-06 | 1986-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15345286U JPS6359325U (ja) | 1986-10-06 | 1986-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359325U true JPS6359325U (ja) | 1988-04-20 |
Family
ID=31072347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15345286U Pending JPS6359325U (ja) | 1986-10-06 | 1986-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359325U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016187059A (ja) * | 2016-08-03 | 2016-10-27 | ラピスセミコンダクタ株式会社 | 半導体装置及び計測機器 |
| US9787250B2 (en) | 2012-04-27 | 2017-10-10 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
-
1986
- 1986-10-06 JP JP15345286U patent/JPS6359325U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9787250B2 (en) | 2012-04-27 | 2017-10-10 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| US10243515B2 (en) | 2012-04-27 | 2019-03-26 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| US10622944B2 (en) | 2012-04-27 | 2020-04-14 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| JP2016187059A (ja) * | 2016-08-03 | 2016-10-27 | ラピスセミコンダクタ株式会社 | 半導体装置及び計測機器 |