JPS63105332U - - Google Patents
Info
- Publication number
- JPS63105332U JPS63105332U JP1986204097U JP20409786U JPS63105332U JP S63105332 U JPS63105332 U JP S63105332U JP 1986204097 U JP1986204097 U JP 1986204097U JP 20409786 U JP20409786 U JP 20409786U JP S63105332 U JPS63105332 U JP S63105332U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- semiconductor
- chip
- pedestal
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Pressure Sensors (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986204097U JPS63105332U (enExample) | 1986-12-24 | 1986-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986204097U JPS63105332U (enExample) | 1986-12-24 | 1986-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63105332U true JPS63105332U (enExample) | 1988-07-08 |
Family
ID=31170036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986204097U Pending JPS63105332U (enExample) | 1986-12-24 | 1986-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63105332U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098213A (zh) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | 一种芯片模组封装定位方法 |
-
1986
- 1986-12-24 JP JP1986204097U patent/JPS63105332U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098213A (zh) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | 一种芯片模组封装定位方法 |