JPH0472627U - - Google Patents
Info
- Publication number
- JPH0472627U JPH0472627U JP1990115841U JP11584190U JPH0472627U JP H0472627 U JPH0472627 U JP H0472627U JP 1990115841 U JP1990115841 U JP 1990115841U JP 11584190 U JP11584190 U JP 11584190U JP H0472627 U JPH0472627 U JP H0472627U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- wire bonding
- widened
- pads
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/5449—
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- H10W72/932—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115841U JPH0472627U (enExample) | 1990-10-31 | 1990-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115841U JPH0472627U (enExample) | 1990-10-31 | 1990-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472627U true JPH0472627U (enExample) | 1992-06-26 |
Family
ID=31863644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990115841U Pending JPH0472627U (enExample) | 1990-10-31 | 1990-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472627U (enExample) |
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1990
- 1990-10-31 JP JP1990115841U patent/JPH0472627U/ja active Pending