JPS6232556U - - Google Patents
Info
- Publication number
- JPS6232556U JPS6232556U JP1985123722U JP12372285U JPS6232556U JP S6232556 U JPS6232556 U JP S6232556U JP 1985123722 U JP1985123722 U JP 1985123722U JP 12372285 U JP12372285 U JP 12372285U JP S6232556 U JPS6232556 U JP S6232556U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- package
- optical
- optical element
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985123722U JPS6232556U (enExample) | 1985-08-12 | 1985-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985123722U JPS6232556U (enExample) | 1985-08-12 | 1985-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6232556U true JPS6232556U (enExample) | 1987-02-26 |
Family
ID=31015081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985123722U Pending JPS6232556U (enExample) | 1985-08-12 | 1985-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6232556U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01289172A (ja) * | 1988-05-16 | 1989-11-21 | Sumitomo Electric Ind Ltd | 光半導体装置 |
-
1985
- 1985-08-12 JP JP1985123722U patent/JPS6232556U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01289172A (ja) * | 1988-05-16 | 1989-11-21 | Sumitomo Electric Ind Ltd | 光半導体装置 |