JPS622248U - - Google Patents
Info
- Publication number
- JPS622248U JPS622248U JP1985092498U JP9249885U JPS622248U JP S622248 U JPS622248 U JP S622248U JP 1985092498 U JP1985092498 U JP 1985092498U JP 9249885 U JP9249885 U JP 9249885U JP S622248 U JPS622248 U JP S622248U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- bonding
- fixed
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/072—
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- H10W72/241—
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- H10W72/536—
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- H10W72/5363—
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- H10W90/722—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985092498U JPS622248U (enExample) | 1985-06-19 | 1985-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985092498U JPS622248U (enExample) | 1985-06-19 | 1985-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622248U true JPS622248U (enExample) | 1987-01-08 |
Family
ID=30649351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985092498U Pending JPS622248U (enExample) | 1985-06-19 | 1985-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622248U (enExample) |
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1985
- 1985-06-19 JP JP1985092498U patent/JPS622248U/ja active Pending