JPS61134047U - - Google Patents
Info
- Publication number
- JPS61134047U JPS61134047U JP1985016690U JP1669085U JPS61134047U JP S61134047 U JPS61134047 U JP S61134047U JP 1985016690 U JP1985016690 U JP 1985016690U JP 1669085 U JP1669085 U JP 1669085U JP S61134047 U JPS61134047 U JP S61134047U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- mounting part
- element mounting
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985016690U JPS61134047U (enExample) | 1985-02-08 | 1985-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985016690U JPS61134047U (enExample) | 1985-02-08 | 1985-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61134047U true JPS61134047U (enExample) | 1986-08-21 |
Family
ID=30503699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985016690U Pending JPS61134047U (enExample) | 1985-02-08 | 1985-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134047U (enExample) |
-
1985
- 1985-02-08 JP JP1985016690U patent/JPS61134047U/ja active Pending