JPH0236053U - - Google Patents
Info
- Publication number
- JPH0236053U JPH0236053U JP1988116058U JP11605888U JPH0236053U JP H0236053 U JPH0236053 U JP H0236053U JP 1988116058 U JP1988116058 U JP 1988116058U JP 11605888 U JP11605888 U JP 11605888U JP H0236053 U JPH0236053 U JP H0236053U
- Authority
- JP
- Japan
- Prior art keywords
- width
- inner lead
- ceramic package
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07554—
-
- H10W72/5445—
-
- H10W72/547—
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- H10W72/932—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116058U JPH0236053U (enExample) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116058U JPH0236053U (enExample) | 1988-09-02 | 1988-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236053U true JPH0236053U (enExample) | 1990-03-08 |
Family
ID=31358268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988116058U Pending JPH0236053U (enExample) | 1988-09-02 | 1988-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236053U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946201A (zh) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | 一种基于局域电沉积的引线键合焊点结构的制备方法 |
| CN108054108A (zh) * | 2017-12-19 | 2018-05-18 | 哈尔滨工业大学 | 一种基于快速局域电沉积的引线键合方法 |
-
1988
- 1988-09-02 JP JP1988116058U patent/JPH0236053U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946201A (zh) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | 一种基于局域电沉积的引线键合焊点结构的制备方法 |
| CN108054108A (zh) * | 2017-12-19 | 2018-05-18 | 哈尔滨工业大学 | 一种基于快速局域电沉积的引线键合方法 |