JPS61106038U - - Google Patents
Info
- Publication number
- JPS61106038U JPS61106038U JP1984191598U JP19159884U JPS61106038U JP S61106038 U JPS61106038 U JP S61106038U JP 1984191598 U JP1984191598 U JP 1984191598U JP 19159884 U JP19159884 U JP 19159884U JP S61106038 U JPS61106038 U JP S61106038U
- Authority
- JP
- Japan
- Prior art keywords
- island
- lead frame
- inner leads
- tips
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984191598U JPS61106038U (enExample) | 1984-12-18 | 1984-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984191598U JPS61106038U (enExample) | 1984-12-18 | 1984-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61106038U true JPS61106038U (enExample) | 1986-07-05 |
Family
ID=30749037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984191598U Pending JPS61106038U (enExample) | 1984-12-18 | 1984-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61106038U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272657A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 半導体装置 |
-
1984
- 1984-12-18 JP JP1984191598U patent/JPS61106038U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272657A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 半導体装置 |