JPS6063945U - 加圧接触型半導体装置 - Google Patents

加圧接触型半導体装置

Info

Publication number
JPS6063945U
JPS6063945U JP15380083U JP15380083U JPS6063945U JP S6063945 U JPS6063945 U JP S6063945U JP 15380083 U JP15380083 U JP 15380083U JP 15380083 U JP15380083 U JP 15380083U JP S6063945 U JPS6063945 U JP S6063945U
Authority
JP
Japan
Prior art keywords
pressure contact
semiconductor device
type semiconductor
contact type
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15380083U
Other languages
English (en)
Other versions
JPH0543474Y2 (ja
Inventor
康夫 山口
Original Assignee
日本インター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インター株式会社 filed Critical 日本インター株式会社
Priority to JP15380083U priority Critical patent/JPS6063945U/ja
Publication of JPS6063945U publication Critical patent/JPS6063945U/ja
Application granted granted Critical
Publication of JPH0543474Y2 publication Critical patent/JPH0543474Y2/ja
Granted legal-status Critical Current

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  • Thyristors (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の加圧接触型半導体装置の説明図であって
、同図Ａはその平面図、同図Ｂはその縦断面図、第２図
は本考案の一実施例を示す加圧接触型半導体装置の縦断
面図、第３図は、上記装置の要部を示す部品図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレットの一重部に互いに分離された島状の第１
    電極、およびこの第１電極を包囲するように設けられた
    第２電極とを有し、この第２電極から外部導出リードを
    引き出す構造の加圧接触型半導体装置において、前記第
    ２電極の外周部全体に加圧接触する導電性リングを設け
    たことを特徴とする加圧接触型半導体装置。
JP15380083U 1983-10-05 1983-10-05 加圧接触型半導体装置 Granted JPS6063945U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15380083U JPS6063945U (ja) 1983-10-05 1983-10-05 加圧接触型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15380083U JPS6063945U (ja) 1983-10-05 1983-10-05 加圧接触型半導体装置

Publications (2)

Publication Number Publication Date
JPS6063945U true JPS6063945U (ja) 1985-05-07
JPH0543474Y2 JPH0543474Y2 (ja) 1993-11-02

Family

ID=30340166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15380083U Granted JPS6063945U (ja) 1983-10-05 1983-10-05 加圧接触型半導体装置

Country Status (1)

Country Link
JP (1) JPS6063945U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147837A (ja) * 1987-12-03 1989-06-09 Mitsubishi Electric Corp 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5213779U (ja) * 1975-07-16 1977-01-31
JPS5437573A (en) * 1977-08-29 1979-03-20 Mitsubishi Electric Corp Semiconductor device
JPS58148433A (ja) * 1982-02-26 1983-09-03 Mitsubishi Electric Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5213779B2 (ja) * 1974-05-16 1977-04-16

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5213779U (ja) * 1975-07-16 1977-01-31
JPS5437573A (en) * 1977-08-29 1979-03-20 Mitsubishi Electric Corp Semiconductor device
JPS58148433A (ja) * 1982-02-26 1983-09-03 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147837A (ja) * 1987-12-03 1989-06-09 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPH0543474Y2 (ja) 1993-11-02

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