JPS61106038U - - Google Patents
Info
- Publication number
- JPS61106038U JPS61106038U JP19159884U JP19159884U JPS61106038U JP S61106038 U JPS61106038 U JP S61106038U JP 19159884 U JP19159884 U JP 19159884U JP 19159884 U JP19159884 U JP 19159884U JP S61106038 U JPS61106038 U JP S61106038U
- Authority
- JP
- Japan
- Prior art keywords
- island
- lead frame
- inner leads
- tips
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000008188 pellet Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図イ〜ロは本考案によるリードフレームを
示し、第１図イは要部平面図、第１図ロは要部断
面図である。第２図イ〜ロは従来のリードフレー
ムを示し、第２図イは要部平面図、第２図ロは要
部断面図である。 主な図番の説明、２はアイランド、３はインナ
ーリード、５は絶縁性テープである。
示し、第１図イは要部平面図、第１図ロは要部断
面図である。第２図イ〜ロは従来のリードフレー
ムを示し、第２図イは要部平面図、第２図ロは要
部断面図である。 主な図番の説明、２はアイランド、３はインナ
ーリード、５は絶縁性テープである。
Claims (1)
- 半導体ペレツトを載置するアイランドと、該ア
イランドの周囲にその先端を近接する如く設けら
れた多数のインナーリードとを具備した半導体装
置用のリードフレームにおいて、前記インナーリ
ードを環状の絶縁性テープで連結したことを特徴
とするリードフレーム。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19159884U JPS61106038U (ja) | 1984-12-18 | 1984-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19159884U JPS61106038U (ja) | 1984-12-18 | 1984-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61106038U true JPS61106038U (ja) | 1986-07-05 |
Family
ID=30749037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19159884U Pending JPS61106038U (ja) | 1984-12-18 | 1984-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61106038U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272657A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 半導体装置 |
-
1984
- 1984-12-18 JP JP19159884U patent/JPS61106038U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272657A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 半導体装置 |
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