JPS63201331U - - Google Patents

Info

Publication number
JPS63201331U
JPS63201331U JP1987092934U JP9293487U JPS63201331U JP S63201331 U JPS63201331 U JP S63201331U JP 1987092934 U JP1987092934 U JP 1987092934U JP 9293487 U JP9293487 U JP 9293487U JP S63201331 U JPS63201331 U JP S63201331U
Authority
JP
Japan
Prior art keywords
electrode
external lead
lead
semiconductor device
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987092934U
Other languages
English (en)
Other versions
JPH0625958Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987092934U priority Critical patent/JPH0625958Y2/ja
Publication of JPS63201331U publication Critical patent/JPS63201331U/ja
Application granted granted Critical
Publication of JPH0625958Y2 publication Critical patent/JPH0625958Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す概略斜視図、
第２図ａ〜ｄは本考案の一実施例を製造する例を
示す各製造工程での概略斜視図、第３図は従来の
半導体装置のワイヤーボンデイング部を示す概略
斜視図、第４図は従来の半導体装置のワイヤーボ
ンデイングの方法を示す各工程での概略斜視図、
第５図は本考案の一実施例のワイヤーボンデイン
グ部分を示す概略斜視図、第６図は従来の半導体
装置のワイヤーボンデイング部分を示す概略斜視
図、第７図は本考案の一実施例のワイヤーボンデ
イング状態を示す概略側面図、第８図は従来の半
導体装置のワイヤーボンデイング状態を示す概略
側面図である。 １……半導体ペレツト、２……リード、３……
電極、４……ワイヤ、５……キヤピラリ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツトと、該半導体ペレツト上に形成
    された電極と、該電極と電気的に接続される外部
    導出リードとを有する半導体装置において、前記
    電極と前記外部導出リードとは前記外部導出リー
    ドに一端および他端が固着され、中間部が切断す
    ることなく連続した状態で前記電極に固着された
    金属ワイヤーにより接続されていることを特徴と
    する半導体装置。
JP1987092934U 1987-06-16 1987-06-16 半導体装置 Expired - Lifetime JPH0625958Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987092934U JPH0625958Y2 (ja) 1987-06-16 1987-06-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987092934U JPH0625958Y2 (ja) 1987-06-16 1987-06-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS63201331U true JPS63201331U (ja) 1988-12-26
JPH0625958Y2 JPH0625958Y2 (ja) 1994-07-06

Family

ID=30955071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987092934U Expired - Lifetime JPH0625958Y2 (ja) 1987-06-16 1987-06-16 半導体装置

Country Status (1)

Country Link
JP (1) JPH0625958Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02215137A (ja) * 1989-02-16 1990-08-28 Sanyo Electric Co Ltd 高周波半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166939U (ja) * 1984-10-05 1986-05-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166939U (ja) * 1984-10-05 1986-05-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02215137A (ja) * 1989-02-16 1990-08-28 Sanyo Electric Co Ltd 高周波半導体装置

Also Published As

Publication number Publication date
JPH0625958Y2 (ja) 1994-07-06

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