JPS63180928U - - Google Patents
Info
- Publication number
- JPS63180928U JPS63180928U JP7115687U JP7115687U JPS63180928U JP S63180928 U JPS63180928 U JP S63180928U JP 7115687 U JP7115687 U JP 7115687U JP 7115687 U JP7115687 U JP 7115687U JP S63180928 U JPS63180928 U JP S63180928U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor element
- bonded
- height
- connect wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Description
第１図及び第２図は本考案半導体装置の一つの
実施例を示すもので、第１図は分解斜視図、第２
図は断面図、第３図及び第４図は本考案半導体装
置の別の実施例を示すもので、第３図は断面図、
第４図は封止前の状態を示す斜視図、第５図は従
来例を示す斜視図である。 符号の説明、２，１２……半導体素子がボンデ
イングされたリード、６，７，１４，１５……リ
ード、３，１３……リードの半導体素子がボンデ
イングされた部分、５……半導体素子。
実施例を示すもので、第１図は分解斜視図、第２
図は断面図、第３図及び第４図は本考案半導体装
置の別の実施例を示すもので、第３図は断面図、
第４図は封止前の状態を示す斜視図、第５図は従
来例を示す斜視図である。 符号の説明、２，１２……半導体素子がボンデ
イングされたリード、６，７，１４，１５……リ
ード、３，１３……リードの半導体素子がボンデ
イングされた部分、５……半導体素子。
Claims (1)
- 【実用新案登録請求の範囲】 装置が備える複数のリードのうちの一つのリー
ドの表面に半導体素子がボンデイングされ、該半
導体素子の電極とそれに対応するリードとの間が
コネクトワイヤを介して接続されている半導体装
置において、 上記半導体素子がボンデイングされたリードの
その半導体素子がボンデイングされた部分の表面
の高さが他のリードの上記コネクトワイヤが接続
された部分の表面の高さよりも低くされてなる、 ことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7115687U JPS63180928U (ja) | 1987-05-13 | 1987-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7115687U JPS63180928U (ja) | 1987-05-13 | 1987-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63180928U true JPS63180928U (ja) | 1988-11-22 |
Family
ID=30913462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7115687U Pending JPS63180928U (ja) | 1987-05-13 | 1987-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63180928U (ja) |
-
1987
- 1987-05-13 JP JP7115687U patent/JPS63180928U/ja active Pending