JPH0252455U - - Google Patents
Info
- Publication number
- JPH0252455U JPH0252455U JP13139288U JP13139288U JPH0252455U JP H0252455 U JPH0252455 U JP H0252455U JP 13139288 U JP13139288 U JP 13139288U JP 13139288 U JP13139288 U JP 13139288U JP H0252455 U JPH0252455 U JP H0252455U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- semiconductor
- electrically connected
- pellet
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000008188 pellet Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る半導体装置の一実施例を
示す正面図、第２図は第１図の平面図である。第
３図は従来の半導体装置の一例を示す正面図、第
４図は第３図の平面図である。 １０……半導体装置、１１……第１の半導体ペ
レツト、１３……第２の半導体ペレツト、１５…
…外部引出し用リード。
示す正面図、第２図は第１図の平面図である。第
３図は従来の半導体装置の一例を示す正面図、第
４図は第３図の平面図である。 １０……半導体装置、１１……第１の半導体ペ
レツト、１３……第２の半導体ペレツト、１５…
…外部引出し用リード。
Claims (1)
- 第１の半導体ペレツト上に、この第１の半導体
ペレツトよりも小さい第２の半導体ペレツトを積
載して電気的に接続し、上記第１の半導体ペレツ
トと外部引出し用リードとを電気的に接続したこ
とを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13139288U JPH0252455U (ja) | 1988-10-06 | 1988-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13139288U JPH0252455U (ja) | 1988-10-06 | 1988-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252455U true JPH0252455U (ja) | 1990-04-16 |
Family
ID=31387416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13139288U Pending JPH0252455U (ja) | 1988-10-06 | 1988-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252455U (ja) |
-
1988
- 1988-10-06 JP JP13139288U patent/JPH0252455U/ja active Pending