JPS6422039U - - Google Patents
Info
- Publication number
- JPS6422039U JPS6422039U JP11691187U JP11691187U JPS6422039U JP S6422039 U JPS6422039 U JP S6422039U JP 11691187 U JP11691187 U JP 11691187U JP 11691187 U JP11691187 U JP 11691187U JP S6422039 U JPS6422039 U JP S6422039U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- utility
- scope
- registration request
- device characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体装置への一実施例の断
面図、第２図は従来の半導体装置の断面図である
。 １……外装樹脂、２……引出しリード、３……
本考案の段差部。
面図、第２図は従来の半導体装置の断面図である
。 １……外装樹脂、２……引出しリード、３……
本考案の段差部。
Claims (1)
- リード引出し部の上面と下面に寸法上の段差を
有することを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11691187U JPS6422039U (ja) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11691187U JPS6422039U (ja) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422039U true JPS6422039U (ja) | 1989-02-03 |
Family
ID=31359882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11691187U Pending JPS6422039U (ja) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422039U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0626175A (ja) * | 1992-07-09 | 1994-02-01 | Sumi Kenzaiten:Kk | 建築用板材の取付け方法と、建築用板材の取付け用釣子 |
| JP2012004179A (ja) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | 半導体装置、半導体装置の実装方法、および実装用治具 |
-
1987
- 1987-07-29 JP JP11691187U patent/JPS6422039U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0626175A (ja) * | 1992-07-09 | 1994-02-01 | Sumi Kenzaiten:Kk | 建築用板材の取付け方法と、建築用板材の取付け用釣子 |
| JP2012004179A (ja) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | 半導体装置、半導体装置の実装方法、および実装用治具 |