JPH0267649U - - Google Patents
Info
- Publication number
- JPH0267649U JPH0267649U JP1988147068U JP14706888U JPH0267649U JP H0267649 U JPH0267649 U JP H0267649U JP 1988147068 U JP1988147068 U JP 1988147068U JP 14706888 U JP14706888 U JP 14706888U JP H0267649 U JPH0267649 U JP H0267649U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- planar shape
- circuit element
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988147068U JPH0267649U (enExample) | 1988-11-10 | 1988-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988147068U JPH0267649U (enExample) | 1988-11-10 | 1988-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267649U true JPH0267649U (enExample) | 1990-05-22 |
Family
ID=31417138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988147068U Pending JPH0267649U (enExample) | 1988-11-10 | 1988-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267649U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015092635A (ja) * | 2015-02-05 | 2015-05-14 | 大日本印刷株式会社 | 半導体装置および半導体装置の製造方法 |
| US9263374B2 (en) | 2010-09-28 | 2016-02-16 | Dai Nippon Printing Co., Ltd. | Semiconductor device and manufacturing method therefor |
-
1988
- 1988-11-10 JP JP1988147068U patent/JPH0267649U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9263374B2 (en) | 2010-09-28 | 2016-02-16 | Dai Nippon Printing Co., Ltd. | Semiconductor device and manufacturing method therefor |
| JP2015092635A (ja) * | 2015-02-05 | 2015-05-14 | 大日本印刷株式会社 | 半導体装置および半導体装置の製造方法 |