JPS6278758U - - Google Patents
Info
- Publication number
- JPS6278758U JPS6278758U JP1985171172U JP17117285U JPS6278758U JP S6278758 U JPS6278758 U JP S6278758U JP 1985171172 U JP1985171172 U JP 1985171172U JP 17117285 U JP17117285 U JP 17117285U JP S6278758 U JPS6278758 U JP S6278758U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor
- mount
- recess
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985171172U JPS6278758U (enExample) | 1985-11-06 | 1985-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985171172U JPS6278758U (enExample) | 1985-11-06 | 1985-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6278758U true JPS6278758U (enExample) | 1987-05-20 |
Family
ID=31106557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985171172U Pending JPS6278758U (enExample) | 1985-11-06 | 1985-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6278758U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0245659U (enExample) * | 1988-09-22 | 1990-03-29 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59101843A (ja) * | 1982-12-01 | 1984-06-12 | Matsushita Electric Works Ltd | 樹脂封止形電子部品 |
-
1985
- 1985-11-06 JP JP1985171172U patent/JPS6278758U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59101843A (ja) * | 1982-12-01 | 1984-06-12 | Matsushita Electric Works Ltd | 樹脂封止形電子部品 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0245659U (enExample) * | 1988-09-22 | 1990-03-29 |