JPH0316336U - - Google Patents
Info
- Publication number
- JPH0316336U JPH0316336U JP1989076552U JP7655289U JPH0316336U JP H0316336 U JPH0316336 U JP H0316336U JP 1989076552 U JP1989076552 U JP 1989076552U JP 7655289 U JP7655289 U JP 7655289U JP H0316336 U JPH0316336 U JP H0316336U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor pellet
- bonding pad
- semiconductor device
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/59—
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- H10W72/884—
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- H10W72/932—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076552U JPH0316336U (enExample) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076552U JPH0316336U (enExample) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316336U true JPH0316336U (enExample) | 1991-02-19 |
Family
ID=31618126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989076552U Pending JPH0316336U (enExample) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316336U (enExample) |
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1989
- 1989-06-29 JP JP1989076552U patent/JPH0316336U/ja active Pending