JPH042046U - - Google Patents
Info
- Publication number
- JPH042046U JPH042046U JP1990041925U JP4192590U JPH042046U JP H042046 U JPH042046 U JP H042046U JP 1990041925 U JP1990041925 U JP 1990041925U JP 4192590 U JP4192590 U JP 4192590U JP H042046 U JPH042046 U JP H042046U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- semiconductor element
- resin
- die
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990041925U JPH042046U (enExample) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990041925U JPH042046U (enExample) | 1990-04-19 | 1990-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042046U true JPH042046U (enExample) | 1992-01-09 |
Family
ID=31553013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990041925U Pending JPH042046U (enExample) | 1990-04-19 | 1990-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042046U (enExample) |
-
1990
- 1990-04-19 JP JP1990041925U patent/JPH042046U/ja active Pending