JPH0262727U - - Google Patents
Info
- Publication number
- JPH0262727U JPH0262727U JP1988142089U JP14208988U JPH0262727U JP H0262727 U JPH0262727 U JP H0262727U JP 1988142089 U JP1988142089 U JP 1988142089U JP 14208988 U JP14208988 U JP 14208988U JP H0262727 U JPH0262727 U JP H0262727U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- recesses
- semiconductor device
- sealed
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988142089U JPH0262727U (enExample) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988142089U JPH0262727U (enExample) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262727U true JPH0262727U (enExample) | 1990-05-10 |
Family
ID=31407736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988142089U Pending JPH0262727U (enExample) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262727U (enExample) |
-
1988
- 1988-10-31 JP JP1988142089U patent/JPH0262727U/ja active Pending