JPS61146960U - - Google Patents
Info
- Publication number
- JPS61146960U JPS61146960U JP1985030581U JP3058185U JPS61146960U JP S61146960 U JPS61146960 U JP S61146960U JP 1985030581 U JP1985030581 U JP 1985030581U JP 3058185 U JP3058185 U JP 3058185U JP S61146960 U JPS61146960 U JP S61146960U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- fixed
- chip
- circuit chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W90/736—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030581U JPS61146960U (enExample) | 1985-03-04 | 1985-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030581U JPS61146960U (enExample) | 1985-03-04 | 1985-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61146960U true JPS61146960U (enExample) | 1986-09-10 |
Family
ID=30530408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985030581U Pending JPS61146960U (enExample) | 1985-03-04 | 1985-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146960U (enExample) |
-
1985
- 1985-03-04 JP JP1985030581U patent/JPS61146960U/ja active Pending