JPH02132955U - - Google Patents
Info
- Publication number
- JPH02132955U JPH02132955U JP1989041363U JP4136389U JPH02132955U JP H02132955 U JPH02132955 U JP H02132955U JP 1989041363 U JP1989041363 U JP 1989041363U JP 4136389 U JP4136389 U JP 4136389U JP H02132955 U JPH02132955 U JP H02132955U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat sink
- dissipation structure
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041363U JPH02132955U (enExample) | 1989-04-07 | 1989-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041363U JPH02132955U (enExample) | 1989-04-07 | 1989-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132955U true JPH02132955U (enExample) | 1990-11-05 |
Family
ID=31551964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989041363U Pending JPH02132955U (enExample) | 1989-04-07 | 1989-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132955U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153069A (ja) * | 2006-12-18 | 2008-07-03 | Toyota Motor Corp | 接続装置 |
| JP2013021229A (ja) * | 2011-07-13 | 2013-01-31 | Fujitsu Ltd | 電子部品とその製造方法 |
| JP2013074656A (ja) * | 2011-09-27 | 2013-04-22 | Nissan Motor Co Ltd | 電力変換装置 |
-
1989
- 1989-04-07 JP JP1989041363U patent/JPH02132955U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153069A (ja) * | 2006-12-18 | 2008-07-03 | Toyota Motor Corp | 接続装置 |
| JP2013021229A (ja) * | 2011-07-13 | 2013-01-31 | Fujitsu Ltd | 電子部品とその製造方法 |
| JP2013074656A (ja) * | 2011-09-27 | 2013-04-22 | Nissan Motor Co Ltd | 電力変換装置 |