JPH03101542U - - Google Patents
Info
- Publication number
- JPH03101542U JPH03101542U JP1990009191U JP919190U JPH03101542U JP H03101542 U JPH03101542 U JP H03101542U JP 1990009191 U JP1990009191 U JP 1990009191U JP 919190 U JP919190 U JP 919190U JP H03101542 U JPH03101542 U JP H03101542U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- encapsulated
- resin material
- thermal conductivity
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009191U JPH03101542U (enExample) | 1990-02-01 | 1990-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009191U JPH03101542U (enExample) | 1990-02-01 | 1990-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101542U true JPH03101542U (enExample) | 1991-10-23 |
Family
ID=31512795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990009191U Pending JPH03101542U (enExample) | 1990-02-01 | 1990-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101542U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031394A1 (fr) * | 1996-02-22 | 1997-08-28 | Nitto Denko Corporation | Dispositif semi-conducteur et son procede de fabrication |
| JP2011023463A (ja) * | 2009-07-14 | 2011-02-03 | Denso Corp | 半導体モジュール |
-
1990
- 1990-02-01 JP JP1990009191U patent/JPH03101542U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031394A1 (fr) * | 1996-02-22 | 1997-08-28 | Nitto Denko Corporation | Dispositif semi-conducteur et son procede de fabrication |
| JP2011023463A (ja) * | 2009-07-14 | 2011-02-03 | Denso Corp | 半導体モジュール |
| US9449893B2 (en) | 2009-07-14 | 2016-09-20 | Denso Corporation | Semiconductor module |