JPH0428449U - - Google Patents
Info
- Publication number
- JPH0428449U JPH0428449U JP1990069002U JP6900290U JPH0428449U JP H0428449 U JPH0428449 U JP H0428449U JP 1990069002 U JP1990069002 U JP 1990069002U JP 6900290 U JP6900290 U JP 6900290U JP H0428449 U JPH0428449 U JP H0428449U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat sink
- oxide film
- utility
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069002U JPH0428449U (enExample) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069002U JPH0428449U (enExample) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428449U true JPH0428449U (enExample) | 1992-03-06 |
Family
ID=31603934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069002U Pending JPH0428449U (enExample) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428449U (enExample) |
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1990
- 1990-06-28 JP JP1990069002U patent/JPH0428449U/ja active Pending