JPS6196547U - - Google Patents
Info
- Publication number
- JPS6196547U JPS6196547U JP1984181717U JP18171784U JPS6196547U JP S6196547 U JPS6196547 U JP S6196547U JP 1984181717 U JP1984181717 U JP 1984181717U JP 18171784 U JP18171784 U JP 18171784U JP S6196547 U JPS6196547 U JP S6196547U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- metal plate
- heat dissipation
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984181717U JPS6196547U (enExample) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984181717U JPS6196547U (enExample) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196547U true JPS6196547U (enExample) | 1986-06-21 |
Family
ID=30739258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984181717U Pending JPS6196547U (enExample) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196547U (enExample) |
-
1984
- 1984-11-30 JP JP1984181717U patent/JPS6196547U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5827934U (ja) | 半導体装置 | |
| JPS5977241U (ja) | 樹脂封止型半導体装置 | |
| JPS63187330U (enExample) | ||
| JPS6163849U (enExample) | ||
| JPH0428449U (enExample) | ||
| JPS6312844U (enExample) | ||
| JPS59112954U (ja) | 絶縁物封止半導体装置 | |
| JPS6194358U (enExample) | ||
| JPS585347U (ja) | 樹脂封止型半導体装置 | |
| JPS63128745U (enExample) | ||
| JPS61207040U (enExample) | ||
| JPS6061729U (ja) | 半導体装置 | |
| JPH0436251U (enExample) | ||
| JPS59164243U (ja) | 樹脂封止半導体装置 | |
| JPS594644U (ja) | 樹脂モ−ルド半導体装置 | |
| JPS6081652U (ja) | 樹脂封止型半導体装置 | |
| JPH03110853U (enExample) | ||
| JPS5840843U (ja) | 樹脂封止型半導体装置 | |
| JPH01120343U (enExample) | ||
| JPS6073235U (ja) | 半導体装置 | |
| JPS61192447U (enExample) | ||
| JPS61127644U (enExample) | ||
| JPS61114842U (enExample) | ||
| JPS6364050U (enExample) | ||
| JPS61100147U (enExample) |